Stacked mass storage flash memory package

ABSTRACT

A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 11/599,223, filed Nov. 13, 2006, pending, which is a divisional of application Ser. No. 10/933,059, filed Sep. 1, 2004, now U.S. Pat. No. 7,375,419, issued May 20, 2008, which is a continuation of application Ser. No. 09/886,593, filed Jun. 21, 2001, now U.S. Pat. No. 6,900,528, issued May 31, 2005. The disclosure of the previously referenced U.S. patent applications referenced are hereby incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to packaged semiconductor devices. More particularly, the invention pertains to flash memory devices having high memory density.

2. State of the Art

The use of semiconductor integrated circuit (IC) chips is widespread, in both commercial grade and specific high reliability applications. Continuing progress in the manufacture of IC chips has resulted in chips of greatly increased density, i.e., higher number of devices per footprint area of each chip. In addition, to produce increasingly complex electronic components, it is necessary to include a much greater number of IC chips on a substrate, e.g., a circuit board. One solution to this dilemma is to form a stack of chips on a substrate, creating what is known in the art as a multi-chip package.

The state of the art in vertically stacked multi-chip module (MCM) devices is illustrated by representative prior art devices shown in drawing FIGS. 1 through 11.

A representative example of a known multi-chip module semiconductor device 10, prior to packaging, is shown in drawing FIG. 1.

A plurality of chips or dice 12A, 12B and 12C (identified as dice 12) are mounted in a pyramidal stack on a substrate 14. Each die is mounted with an adhesive material 16 to the next lower die or substrate and is electrically connected to the substrate 14 by bond wires 18 using known wire bonding methods. Variants of this multi-chip configuration are described in U.S. Pat. No. 5,422,435 to Takiar et al., Japan Patent 62-8534(A) to Tsukahara and Japan Patent 3-165550(A) to Yashiro. In each of these references, a pyramidal stack is formed of increasingly smaller chips or dice 12, in order to accommodate the placement of bond wires 18 on peripheral portions of each die 12. This configuration is not generally useful where dice of equal dimensions are to be placed in a multi-chip module (MCM), such as in a memory device.

In drawing FIG. 2, a pyramidal stack of chips in device 10 is shown as described in U.S. Pat. No. 5,399,898 to Rostoker. In these references, the dice 12A, 12B, 12C comprise “flip-chips” with solder bumps or balls 20 joined to conductive areas on the back side 22 of the underlying flip-chip.

Depicted in drawing FIG. 3 is an MCM device 10 in which a first die 12A is attached to a substrate 14 with adhesive material 16 and is electrically connected to the substrate 14 with bond wires 18. A second die 12B is stacked atop the first die 12A and connected to it by solder balls 20. The second die 12B is smaller than the first die 12A, in order to leave access to the first die's 12A conductive areas. This type of arrangement is depicted in Japan Patent 56-158467(A) to Tsubouchi, and a variant thereof is described in Japan Patent 63-104343 to Kuranaga.

Depicted in drawing FIG. 4 is an MCM device 10 formed of dice 12A and 12D mounted on opposite surfaces of a substrate 14. In this example, the substrate 14 is a lead frame, and the construction permits both of the dice 12A, 12D to be connected to a metallization on one surface of the lead frame. This construction is described in U.S. Pat. No. 5,012,323 to Farnworth.

Each of the above stacking configurations requires that the dice be of differing sizes. This is mandated by the need to leave the bond pads of each die unobstructed for wire attachment.

There have been various configurations of MCM devices in which chips of equal dimensions are stacked. Several such configurations are shown in drawing FIGS. 5, 6, 7, 8, 9, 10 and 11 and described below.

In one MCM device configuration shown in U.S. Pat. No. 5,973,403 to Wark and Japan Patent 5-13665(A) to Yamauchi, a flip-chip die 12A is electrically bonded to a substrate 14 by posts, solder bumps or balls 20 or other connectors, and a second chip, i.e., die 12B, is attached back-to-back to the flip-chip die 12A (with an intervening insulation layer 24) and connected by bond wires 18 to the substrate 14. This particular MCM device 10 is illustrated in drawing FIG. 5.

In another form depicted in drawing FIG. 6, two dice 12A, 12B are mounted on opposite sides of a substrate 14, with intervening insulation layers 24. The dice 12A, 12B are shown with bond wires 18. This general dice-to-substrate configuration with variants is pictured in U.S. Pat. No. 5,147,815 to Casto, U.S. Pat. No. 5,689,135 to Ball, and U.S. Pat. No. 5,899,705 to Akram.

An MCM device 10 that combines various die configurations already described above in drawing FIGS. 1 through 6 is shown in U.S. Pat. No. 6,051,878 to Akram et al. The apparatus uses conductive column-like structures to connect substrates that carry the dice.

As shown in drawing FIG. 7, an MCM device 10 described in U.S. Pat. No. 5,483,024 to Russell et al. has two identical dice 12A, 12B with central bond pads. The dice are sandwiched between and attached to two lead frames 14A, 14B with discontinuous adhesive layers 16A and 16B. The dice 12A, 12B are joined by an intervening insulation layer 24. Bond wires 18 connect each die to the corresponding lead frame.

In drawing FIG. 8, a stacked MCM device 10 is depicted in accordance with the disclosure of U.S. Pat. No. 5,323,060 to Fogal et al. In this device, dice 12A, 12B, 12C, and 12D are vertically alternated with adhesive layers 16A, 16B and 16C. The thickness of the adhesive layers is enhanced to be greater than the bond wire loop height, so that bond wires 18 may be attached to the active surfaces of the dice, for connection to the substrate 14.

Described in U.S. Pat. No. 5,291,061 to Ball is a similar stacked device 10 in which the thickness of the adhesive layers 16A, 16B and 16C is reduced, using a low-loop-profile wire-bonding operation.

As shown in drawing FIG. 9, a device configuration generally shown in U.S. Pat. No. 5,399,898 to Rostoker uses an upper flip-chip die 12E to join dice 12A mounted on a substrate 14. The dice 12A are connected to substrate metallization with bond wires 18. Thus, the device 10 comprises three dice connected serially.

There are various forms of an MCM device in which separate enclosed units are first formed and then stacked. Examples are described in U.S. Pat. No. 5,434,745 to Shokrgozar et al. and U.S. Pat. No. 5,128,831 to Fox, III et al. A typical stacked device 10 of this construction is depicted in drawing FIG. 10, showing three units. Each unit comprises an intermediate substrate 15A with a metalized surface. A die 12A, 12B or 12C is mounted on the intermediate substrate 15A and connected to the metallization 30 by bond wires 18. A wall 32 surrounding each die 12 encloses the die 12, bond wires 18, and metallization 30. The various metallization leads extend to conductive columns 34 within the wall 32, the latter connected to metallization 40 on substrate 14. An insulative cover 38 protects the upper unit and forms a protective shell about the device.

In another design of MCM package device 10 shown in drawing FIG. 11, a plurality of dice 12A, 12B, . . . have beveled edges 28 that permit the bonding of wires to edge bond pads on the active surfaces 26. This design requires that the die thickness 36 be sufficiently great to accommodate wire loop height in the beveled regions. If the die thickness 36 is insufficient, the thickness of adhesive material 16 must be increased. Thus, the device height will be increased. Also, the beveled edges 28 are weak and subject to breakage.

In each of the above prior art configurations for forming MCM devices containing a stack of identically configured dice, various limitations and/or problems exist as indicated above. A new device design is needed in which a plurality of identical dice with bond pads along one edge or two edges may be readily stacked for parallel operation. The new design must provide a device requiring fewer manufacturing steps and providing high density with enhanced reliability.

BRIEF SUMMARY OF THE INVENTION

In accordance with the invention, a stacked multiple chip device is formed of two or more chips, i.e., dice, in which bond pads are located in areas along one or two edges of the active surface of each die. The device of the invention is particularly useful when configured to be formed of a stack of semiconductor dice that are substantially the same or similar in shape, size and bond pad arrangement, although not necessarily of identical shape, size and bond pad arrangement. An example of this die configuration is a mass memory storage device with a row or rows of bond pads along one edge of the semiconductor die.

In a device of this invention, the dice are arranged in a stack in which each individual semiconductor die is positionally offset from the next lower semiconductor die, thus exposing the bond pads of each die for wire bonding or other conductor attachment. In some embodiments, a semiconductor die may overhang bond pads of an underlying semiconductor die, but the thickness of an intervening offset semiconductor die supporting the overhanging semiconductor die, together with two thin adhesive layers, provides sufficient “headroom” to accommodate the wire loop height. The thickness (Z-dimension) of adhesive layers may be minimized to reduce overall device height. Where bond pads are overhung by another die, wire bonding is successfully accomplished without the use of thick adhesive layers.

A substrate may be any body that supports the device, including, for example, a circuit board, a circuit card such as a multiple memory card, a lead frame or a tape automated bonding (TAB) tape. The bond pads of each die are exposed for rapid precise bond wiring to the substrate. In one embodiment, the apparatus is formed as a single stack of dice connected to a substrate whose reverse surface is configured for solder-ball bonding to another metalized surface.

In this invention, semiconductor dice having bond pads along one edge only need not be offset from each other in more than one direction. Semiconductor dice configured with bond pads along two adjacent edges are always offset from each other along two axes, i.e., in two directions. The offset exposes bond pads of a lower die to permit convenient wire bonding between each chip and a substrate.

Where the stack comprises more than two semiconductor dice, the offset of each semiconductor die may be positive or negative along both axes. The stack may include a reversal in the direction of offset. In this case, the die underlying the die having an offset direction change must also be rotated in orientation about a central Z-axis. The active surface of the semiconductor die may be rotated to place the bond pads adjacent a different location of the substrate. Such rotation may comprise zero, 90, 180 or 270 degrees in a clockwise or counter-clockwise direction.

Packaging of the device may use conventional processes for enclosing the semiconductor dice and conductors in a plastic, metal or ceramic encapsulant.

Some embodiments of the invention having up to four or more semiconductor dice provide complete exposure of all bond pads.

Use of this design provides adequate space for wire-bonding the bond pads that underlie die edges of a higher semiconductor die, because the spacer consists not of a thick adhesive layer, but an intervening die or a piece of silicon or similar material substantially the same size as the semiconductor die. In some instances, inoperative semiconductor dice may be used in the stack between operative semiconductor dice located on either side thereof. The designs of the stack and the substrate are coordinated to provide an easily formed device that may, for example, have a high memory density, minimal height, short bond wires, small footprint, and high speed and responsiveness. In one embodiment, the package is particularly useful as a high speed multi-die mass storage flash memory device with a high memory density.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1 through 11 are side views of various prior art configurations of multi-chip module (MCM) devices;

FIG. 12 is an isometric view of an offset stacked multiple die device with a single offset in accordance with the invention;

FIG. 12A is an isometric view of an offset stacked multiple die device with a single offset, mounted on a lead frame, in accordance with the invention;

FIG. 12B is an isometric view of an offset stacked multiple die device with a single offset die of smaller size, mounted on a lead frame, in accordance with the invention;

FIG. 12C is an isometric view of an offset stacked multiple die device with a single offset die of larger size, mounted on a lead frame, in accordance with the invention;

FIG. 13 is a side view of an offset stacked multiple die device with a single offset in accordance with the invention;

FIG. 14 is a plan view of an offset stacked multiple die device with a single offset in accordance with the invention;

FIG. 15 is a side view of another embodiment of an offset stacked multiple die device in accordance with the invention;

FIG. 16 is a side view of a further embodiment of an offset stacked multiple die device in accordance with the invention;

FIGS. 17 through 24 are simplified side views of various exemplary embodiments of unencapsulated stacked multiple die devices having different configurations of one-axis die stacking and wire bonding, in which:

FIG. 17 is a side view of an offset stacked multiple die device having forwardly offset dice connected to a substrate, in accordance with the invention;

FIG. 18 is a side view of another embodiment of an offset stacked multiple die device having forwardly offset dice connected to a substrate, in accordance with the invention;

FIG. 19 is a side view of an offset stacked multiple die device having one rearwardly offset die and two forwardly offset dice connected to a substrate, in accordance with the invention;

FIG. 20 is a side view of another embodiment of an offset stacked multiple die device having one rearwardly offset die and two forwardly offset dice connected to a substrate, in accordance with the invention;

FIG. 21 is a side view of an offset stacked multiple die device having two rearwardly offset dice and one forwardly offset die connected to a substrate, in accordance with the invention;

FIG. 22 is a side view of another embodiment of an offset stacked multiple die device having two rearwardly offset dice and one forwardly offset die connected to a substrate, in accordance with the invention;

FIG. 23 is a side view of an offset stacked multiple die device having four dice with alternating forward and rearward offset, connected to a substrate, in accordance with the invention;

FIG. 24 is a side view of another embodiment of an offset stacked multiple die device having four dice with alternating forward and rearward offset, connected to a substrate, in accordance with the invention;

FIG. 25 is a side view of another embodiment of an offset stacked multiple die device having four dice that are sequentially rotated and offset in at least one direction;

FIG. 26 is a plan view of an embodiment of an offset stacked multiple die device having four dice that are sequentially rotated and offset in at least one direction, in accordance with the invention;

FIG. 27 is an isometric view of an offset stacked multiple die device formed of two dice with bond pads along two adjacent edges wherein an upper die is offset from an underlying die along both the X-axis and Y-axis in accordance with the invention;

FIG. 28 is a side view of an offset stacked multiple die device formed of four elongated dice that have bond pads along two opposing edges wherein dice are arranged in an alternating sequence providing an offset from all dice, in accordance with the invention; and

FIG. 29 is a plan view of an offset stacked multiple die device formed of four elongated dice that have bond pads along two opposing edges wherein dice are arranged in an alternating sequence providing an offset from all dice, in accordance with the invention.

DETAILED DESCRIPTION OF THE INVENTION

A new stacked multiple chip device formed of a plurality of offset Z-stacked, i.e., vertically stacked semiconductor dice, together with a method of production thereof are provided by the invention. Some devices of the invention may be classified as stacked multi-chip modules (MCM). Semiconductor dice that are particularly usefully stacked in this construction are those having conductive bond pads along one edge, or alternatively along two adjacent edges of the active surface. In addition, a particular embodiment will be described that utilizes elongated, i.e., semiconductor dice having bond pads along opposing distal edges of a nonsquare elongated active surface. Although the device is particularly adapted to dice of the same surface dimensions and similar bond pad layout, a stack of dice may be formed in accordance with this invention that includes one or more semiconductor dice of a differing configuration at either end of the stack, or interposed therein. The stack of semiconductor dice is physically attached to a substrate, in which the substrate may comprise, for example, a printed circuit board (PCB), a memory card, a lead frame, tape automated bonding (TAB) tape or other substrate. Additionally, similar shaped dummy dice of silicon and the like may be used as spacers between semiconductor dice in the stack.

In the figures and this description, semiconductor dice and any spacers in general will be denoted by the numeral 60, and a letter suffix i.e., A, B, C, etc. will be used to identify a particular semiconductor die or spacer or the like of a stack. Numerals identifying bond pads, bond wires, etc., that relate to a particular semiconductor die will carry the same suffix.

In this description, bond wires will be described as being connected between a semiconductor die and a substrate. It is to be understood that the wires are bonded to bond pads on the semiconductor die and to conductive members such as metallization or a lead frame, which may constitute all or part of the substrate. The device may also include semiconductor die-to-semiconductor die bonds.

With reference to the drawings of drawing FIGS. 12-12C, 13 and 14, which describe an embodiment of the instant invention, a semiconductor device 50 having a multi-chip module (MCM) type of configuration comprises two semiconductor dice 60A and 60B as a stack 61. This configuration is particularly appropriate to flash memory packages in which the die circuits are connected in parallel. In this configuration, the semiconductor dice 60A, 60B have essentially identical circuits and have upwardly facing active surfaces 52A, 52B with bond pads 54A, 54B along one edge 56A, 56B of each active surface, respectively. The bond pads of each semiconductor die 60 are collectively designated as a “field” 55 of bond pads. Each semiconductor die 60A, 60B has a length dimension 104 and a width dimension 106 that may be equal or unequal thereby making the semiconductor die 60A, 60B have different physical sizes and shapes.

Semiconductor die 60A is shown attached to a substrate 70 by adhesive layer 78. The adhesive layer 78 may be any adhesive capable of bonding a reverse surface 72 of a semiconductor die 60 to the active surface 52 of another semiconductor die or to a top side 66 of a substrate 70. Semiconductor die 60B is stacked on top of semiconductor die 60A and joined to it by thin adhesive layer 78. Semiconductor die 60B is offset from semiconductor die 60A along Y-axis 76 a distance 82, which exposes the field 55 of bond pads 54A. The offset distance 82 may be the shortest distance that permits reliable use of a wire bonding tool, not shown, to bond conductors such as bond wires 62 to the bond pads 54A. Thus, bond pads 54A, 54B are joined by fine metal bond wires 62 or other conductive members to conductive, e.g., metallization areas 58 on the top side 66 of substrate 70. If so dictated by the design of the device 50, certain bond pads 54A and 54B may also be conductively connected to each other, i.e., on the same semiconductor die 60A or 60B, or from semiconductor die 60A to semiconductor die 60B.

In these figures, the substrate 70 is pictured as a circuit board or memory card substrate or multimedia card substrate, for example. This example is shown with solder balls 64 on its reverse side 68 although other configurations of electrical connections may be used.

A controlled thickness thermoplastic or other type of adhesive may be used in adhesive layers 78 to join the semiconductor dice 60A and 60B to each other, and semiconductor die 60A to the substrate 70.

The bond pads 54A and 54B of semiconductor dice 60A and 60B, respectively, are joined to metallization or other conductive areas 58 on the substrate 70 by thin bond wires 62. Typically, the bond wires 62 have a diameter of about 0.001 inch and are formed of a metal such as aluminum or gold, or alloys thereof. The preferred method of bonding the bond wires 62 to the bond pads is known as ultrasonic ball bonding, which forms a low-loop wire bond that is less than the Z-dimension of a semiconductor die 60. Likewise, in a preferred method, ultrasonic “wedge” bonds of wire are formed at the substrate metallization area 58.

In general, semiconductor devices are encapsulated in a protective package to protect the die surfaces, metallization and wires from damage. As depicted in drawing FIGS. 12 through 14, edges of an exemplary equiangular encapsulating enclosure are defined by dashed lines 84. The encapsulant material may be a polymer, ceramic or other protective material. As shown, the completed, i.e., packaged device 50 may be formed to have a low profile vertical (Z) dimension 86 (excluding solder balls 64) that is less than prior stacked device heights, because thick intervening layers of adhesive are not required between adjacent semiconductor dice 60.

A stack 61 of two or more offset semiconductor dice 60 may also be formed on a lead frame 94, as depicted in an example in drawing FIG. 12A. The lead frame 94 is typically formed from a material such as copper, copper alloys, iron-nickel alloys, or the like. Other materials, such as TAB tape, could be used in accordance with this invention as well. The lead frame 94 is shown with opposing runners 96, a central paddle 98, and leads 102A and 102B to which wires are attached. The lead frame 94 has alignment mechanisms 100 such as precisely positioned marks or holes, for precise positioning of the lead frame 94 during operations such as die bonding and wire bonding where alignment is critical. In this example, semiconductor die 60A is attached to a paddle 98 of lead frame 94 with a thin adhesive layer, not shown. The paddle 98 serves as a substrate to support the stack 61. Semiconductor die 60B is then attached to overlie a major portion of semiconductor die 60A, wherein the die edge 56B along which bond pads 54 are positioned is offset a distance 82 from the die edge 56A of the lower semiconductor die 60A, to expose the bond pads 54. As shown, conductive bond wires 62A are connected from bond pads 54 of semiconductor die 60A to appropriate leads 102A. Likewise, bond wires 62B are connected from bond pads 54 to leads 102B. Alternatively, TAB bonding or other bonding methods may be used. As illustrated in drawing FIG. 12B, the semiconductor die 60B is of smaller size than that of semiconductor die 60A. Further, as illustrated in drawing FIG. 12C, the semiconductor die 60B is of larger size than semiconductor die 60A having three sides of the semiconductor die 60B overhanging the semiconductor die 60A.

In the embodiment of drawing FIGS. 12 through 14, both of the semiconductor dice 60A, 60B have their bond pads 54, 54A, 54B oriented in the same direction so that they are connected by bond wires 62 to metallization areas 58 on the same side of the device 50. However, semiconductor die orientation and other factors, such as semiconductor dice having different sizes and dimensions, may be changed to suit a particular application. Thus, major design factors affecting the stacked offset multiple semiconductor die device 50 include the number of semiconductor dice 60 in the stack 61, die dimensions, number of die edges 56 along which bond pads 54 are arrayed, offset direction(s), offset distance 82 and rotation angle of each semiconductor die 60 relative to the semiconductor die 60 just below.

As shown in drawing FIG. 15, semiconductor die 60B has been rotated 180 degrees about central Z-axis 88 such that its edge 56B along which bond pads 54B are positioned is opposite in direction to edge 56A of semiconductor die 60A. It is evident that semiconductor die 60B may alternatively be rotated zero degrees, 90 degrees, 180 degrees or 270 degrees relative to semiconductor die 60A. The conductive metallization area 58 on the substrate 70 must be configured for providing short bond wire connections with the bond pads 54A, 54B.

Depicted in drawing FIG. 16 is an offset stacked two-semiconductor die device 50 in which the upper semiconductor die 60B is rotated 90 degrees clockwise about Z-axis 88. Thus, the row(s) of bond pads 54B are rotated 90 degrees from the row(s) of bond pads 54A. In this embodiment, both semiconductor dice 60A, 60B are depicted as having active surfaces 26 that are substantially square but the device 50 may be formed of substantially nonsquare semiconductor dice.

As will be evident, a variety of offset stacking configurations is available when using semiconductor dice 60 with bond pads 54 along one edge 56. Depicted in drawing FIGS. 17 through 24 is a variety of such configurations; this application is not limited to these particular configurations, which serve as examples. Each of these figures relates to a stack 61 of four offset semiconductor dice 60A, 60B, 60C and 60D in which individual semiconductor die may be offset in a forward direction, i.e., to the right, or in a reverse direction, i.e., to the left. In addition, an individual semiconductor die 60 may be rotated 180 degrees so that the bond pad location is reversed relative to the underlying semiconductor die. Reversal of a semiconductor die 60 results in attachment of its bond pads 54 to substrate 70 in a different location.

For the sake of clarity, drawing FIGS. 17 through 24 do not show adhesive layers, encapsulating material or other details of the device 50. The number of semiconductor dice 60 comprising the stack 61 is limited only by design, construction and operational limitations such as materials strength, heat generation and dissipation, electric operability and the like. The design of the stack 61 must be coordinated with substrate design, i.e., to ensure accurate and rapid wire bonding and meet other design criteria.

As shown in drawing FIG. 17, a plurality of semiconductor dice 60A, 60B, 60C and 60D may be consecutively stacked in a single offset direction, denoted herein as a “forward” direction. All of the semiconductor dice have bond pads 54 facing in the same direction. In this stacking configuration, the bond wires 62A, 62B, 62C or 62D of each semiconductor die is bonded to a substrate 70 at the same side of the stack 61.

The embodiment of drawing FIG. 18 differs from drawing FIG. 17 in that the uppermost semiconductor die 60D is rotated 180 degrees relative to the other semiconductor dice 60A, 60B, 60C, and has bond pads 54D attached to the substrate 70 on the other side of the stack 61.

Illustrated in drawing FIGS. 19 through 24 are other offset multiple semiconductor die devices 50 in which semiconductor dice 60 are offset in both forward and reverse directions.

Illustrated in drawing FIGS. 19 and 20 are devices 50 that have a second semiconductor die 60B with a reverse offset and that is rotated 180 degrees relative to lowermost semiconductor die 60A. Semiconductor dice 60C and 60D are similarly rotated relative to semiconductor die 60A, and each is forwardly offset from its underlying die. In drawing FIG. 19, the bond wires 62 from the three upper semiconductor dice 60B, 60C and 60D are bonded to the substrate 70 on the same side of the stack 61, while semiconductor die 60A is bonded on the opposing side of the stack. In drawing FIG. 20, semiconductor die 60D is attached to the stack 61 in an unrotated position relative to semiconductor die 60A. Semiconductor die 60D has its bond wires 62D connected to substrate 70 in the vicinity of bond wires 62A, i.e., on the opposite side of the stack from bond wires 62B and 62C.

As illustrated in drawing FIGS. 21 and 22, semiconductor dice 60B and 60C are offset in a reverse direction from semiconductor die 60A, and semiconductor die 60D is offset in a positive direction from underlying semiconductor die 60C. Illustrated in drawing FIG. 21, semiconductor dice 60C and 60D are both rotated 180 degrees relative to semiconductor dice 60A and 60B, so that their bond pads 54C and 54D face in an opposite direction from bond pads 54A and 54B. Illustrated in drawing FIG. 22, semiconductor die 60D of the device 50 in drawing FIG. 21 has been rotated 180 degrees and its bond wires 62D attached to the substrate 70 in the vicinity of bond wires 62A and 62B.

As shown in drawing FIG. 23, the semiconductor dice 60 in stack 61 may be ordered in an alternating fashion with respect to both die rotation, i.e., between a forward and reverse direction, and offset direction.

Alternatively, as shown in drawing FIG. 24, the uppermost semiconductor die 60D of a stack may have the same alternating offset pattern as the device 50 of drawing FIG. 23, but be rotated to have the same rotational orientation as its underlying semiconductor die 60C. The bond wires 62D will be joined to the substrate 70 in the vicinity of bond wires 62A and 62C.

Where the bond pads 54 of a semiconductor die 60 are overhung by a portion of another semiconductor die, those bond pads 54 may be wire-bonded to the substrate 70 prior to mounting the overhanging die in the stack 61. Using the configuration illustrated in drawing FIG. 19 as an example, it is seen that bond pads 54A are overhung by a portion of semiconductor die 60C. The height 92 of wire loop 90 is less than the die thickness 36, enabling wire bonding without subsequent contact of bond wires 62 with the overhanging semiconductor die 60C or intervening semiconductor die 60B or silicon spacer 60B.

Turning now to drawing FIGS. 25 and 26, another embodiment of an offset stacked device 50 is shown with a stack 61 of four semiconductor dice 60A, 60B, 60C and 60D. Each semiconductor die 60 has a square active surface 52 and all semiconductor dice 60 are constructed to be physically identical. By rotating each semiconductor die 60 to be 90 degrees from the next lower die, and offsetting each successive semiconductor die to avoid the bond pads 54 of the next lower semiconductor die, all bond pads 54 of the four semiconductor dice 60 are exposed for wire bonding in a single uninterrupted step.

The stacked offset multiple die device 50 of this invention may have any form of substrate 70 known in the art. For example, the substrate 70 may be a metalized lead frame as already shown in drawing FIG. 12A.

Turning now to drawing FIG. 27, yet another embodiment of an offset stacked device 50 of the invention is shown that is formed of two or more semiconductor dice such as semiconductor dice 60A, 60B having conductive bond pads 54A and 54B, respectively. The two semiconductor dice 60A, 60B are joined together and to substrate 70 by thin adhesive layers 78. On each semiconductor die 60A and 60B, the bond pads 54A and 54B are shown as formed along two adjacent edges of the semiconductor die 60A and 60B. Thus, for example, semiconductor die 60A has bond pads 54AA formed along die edge 56AA, and bond pads 54AB formed along adjacent die edge 56AB. Likewise, semiconductor die 60B has bond pads 54BA formed along die edge 56BA. Semiconductor die 60B also has bond pads 54BB formed along die edges 56BB. Bond wires 62AA, 62BA, 62AB, 62BB connect substrate 70 to semiconductor dice 60A, 60B.

As shown in drawing FIG. 27, semiconductor die 60B is offset in position in two directions. Thus, semiconductor die 60B is offset from semiconductor die 60A a distance 82A along the X-axis 74 and a distance 82B along the Y-axis 76, whereby all of the bond pads 54AA and 54AB of semiconductor die 60A are exposed for easy wire bonding.

Additional semiconductor dice 60 may be mounted atop semiconductor die 60B. These semiconductor dice may be mounted in the same sequence, using a substrate 70 configured with metallization on two sides only of the stack 61. Alternatively, subsequent semiconductor dice 60C, may be mounted atop semiconductor die 60B having the same pattern of offset, i.e., along both the X-axis 74 and Y-axis 76, but rotated 180 degrees relative to semiconductor dice 60A and 60B. As a result, wire bonds will be made to the substrate 70 on four sides of stack 61.

A further embodiment of the invention is illustrated in drawing FIGS. 28 and 29, in which a semiconductor die stack 61 is formed of semiconductor dice 60 having bond pads 54 on each of two opposed edges 56 of the semiconductor die's active surface 52 (not shown). In this configuration, each added semiconductor die 60 is rotated 90 degrees or 270 degrees from the underlying semiconductor die to place the semiconductor die in an offset position. Each semiconductor die 60 has a length dimension 104 (see FIG. 27) that is longer than a width dimension 106 (see FIG. 27) by at least two times the required offset, i.e., to expose the bond pads 54 of the underlying semiconductor die. If desired, the semiconductor dice 60 can be of any convenient physical size and be of different physical size than the other. Use of more than two semiconductor dice 60 in the stack 61 results in semiconductor die bond pads 54 being overhung by a semiconductor die that is two positions higher in the stack. The manufacturing process will require intermediate wire bonding operations in this case. The stack configuration results in bond wires 62A and 62C to metallization areas 58 of the substrate 70 on two opposing sides of the stack 61, and bond wires 62B and 62D on the other two opposing sides of the stack. Thus, bond wires are located on all four sides of the stack 61.

As described herein, the invention provides a stacked multiple semiconductor die device or package of higher electronic density, in which individual die of similar size, different size, or the same size are offset from each other in the stack, enabling electrical attachment, e.g., wire bonding between the semiconductor dice and a substrate. Thus, the overall height of the stack of semiconductor dice, and the package formed therefrom, is minimal. Multiples of the stacked multiple die package may be combined in a large mass storage flash memory apparatus, for example.

The various embodiments of stacked offset multiple semiconductor die devices that are shown and described herein are exemplary and not limiting. It is understood that other configurations may include additional elements, for example, such elements including additional semiconductor dice and lead frames, heat sinks, dielectric layers, packaging, etc., as known in the art.

It is apparent to those skilled in the art that various changes and modifications may be made in the packaging methods and products of the invention as disclosed herein without departing from the spirit and scope of the invention as defined in the following claims. 

1. A method for forming a stacked multiple-semiconductor die device, comprising: attaching a backside of a first semiconductor die having an active surface including at least four edges, and a backside, and a field of conductive bond pads disposed on the active surface of the first semiconductor die along two edges of the active surface which are opposed from each other, the field of conductive bond pads positioned along less than three edges of the active surface of the first semiconductor die to a surface having at least one conductive bond area of one side of a substrate having contact pads on the other side thereof adjacent at least one conductive bond area of the substrate surface and the backside of a second semiconductor die is attached to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die being exposed; forming conductors connecting bond pads of the first semiconductor die to the at least one conductive bond area of the substrate; forming conductors connecting bond pads of the second semiconductor die having an active surface including at least four edges, and a backside, and a field of conductive bond pads disposed on the active surface of the second semiconductor die, the field of conductive bond pads positioned along less than three edges of the active surface of the second semiconductor die to one of the at least one conductive bond area of the substrate and conductive bond pads of the first semiconductor die; and attaching solder balls to contact pads on another side of a substrate, the contact pads on the another side of the substrate connected to at least one contact pad on one side of the substrate.
 2. The method of claim 1, wherein a plurality of semiconductor dice comprises a stack of semiconductor dice having one of substantially the same dimensions and different dimensions.
 3. The method of claim 1, further comprising stacking at least one additional semiconductor die having a backside attached to at least a portion of the active surface of a next lower semiconductor die in an offset position, the field of conductive bond pads of each semiconductor die being exposed for attachment of the conductors thereto.
 4. The method of claim 1, further comprising attaching the first semiconductor die to the substrate by a thin adhesive layer and attaching the second semiconductor die to the first semiconductor die by a thin adhesive layer.
 5. The method of claim 1, further comprising providing a semiconductor die having a field of conductive bond pads along one edge thereof, and offsetting the second semiconductor die from the first semiconductor die in one direction to expose the conductive bond pads of the first semiconductor die for establishing connections from the bond pads to the substrate.
 6. The method of claim 5, further comprising affixing at least one additional semiconductor die in a stack to the second semiconductor die and offsetting each additional semiconductor die from its underlying semiconductor die, each semiconductor die being offset in the same direction from its underlying semiconductor die.
 7. The method of claim 4, further comprising rotating at least one of the plurality of semiconductor dice by one of 90, 180, and 270 degrees relative to its underlying semiconductor die.
 8. The method of claim 7, wherein the at least one rotated semiconductor die is an uppermost semiconductor die.
 9. The method of claim 8, wherein the at least one rotated semiconductor die is intermediate the first semiconductor die and the uppermost semiconductor die.
 10. The method of claim 3, further comprising affixing at least another additional semiconductor die in a stack to the second semiconductor die and offsetting each additional semiconductor die from its underlying semiconductor die, at least one of the second semiconductor die and a third semiconductor die being rotated 180 degrees relative to the first semiconductor die.
 11. The method of claim 10, further comprising rotating each semiconductor die 180 degrees from its underlying semiconductor die and offsetting each semiconductor die in a reverse direction thereto.
 12. The method of claim 1, further comprising attaching at least one additional semiconductor die in a stack to the second semiconductor die and offsetting each additional semiconductor die from its underlying semiconductor die, the second semiconductor die and each subsequent semiconductor die being rotated 90 degrees from its underlying semiconductor die to position bond pads on at least three sides of the stack.
 13. The method of claim 3, further comprising providing each semiconductor die having the field of conductive bond pads along two adjacent edges thereof and offsetting each of the second semiconductor die and subsequent semiconductor dice being offset from its underlying semiconductor die in two directions exposing the conductive bond pads thereof for conductive bonding.
 14. The method of claim 13, further comprising offsetting each semiconductor die in the same two directions relative to its underlying semiconductor die.
 15. The method of claim 13, further comprising rotating at least one semiconductor die 180 degrees from its underlying semiconductor die.
 16. The method of claim 15, wherein the at least one rotated semiconductor die includes a topmost semiconductor die.
 17. The method of claim 3, further comprising offsetting each semiconductor die that has a length greater than a width by rotating one semiconductor die relative to an underlying adjacent semiconductor die thereby offsetting the first semiconductor die to expose the field of conductive bond pads for attaching the conductors thereto.
 18. The method of claim 1, comprising: attaching conductive bond wires with loops to a lower semiconductor die having a field of conductive bond pads positioned thereon; overhanging the field of conductive bond pads of an upper semiconductor die by a first height; and attaching an intervening semiconductor die having an upper surface bonded to the upper semiconductor die with an adhesive layer and a lower surface bonded to the lower semiconductor die with an adhesive layer, the intervening semiconductor die offset from the lower and upper semiconductor dice, a height of overhang between the lower semiconductor die and the upper semiconductor die being substantially equal to the thickness of the intervening semiconductor die and the two adhesive layers and the height of overhang exceeding the height of bond wire loops attached to the conductive bond pads of the lower semiconductor die.
 19. The method of claim 18, further comprising providing the intervening semiconductor die which includes one of a piece of silicon and an inoperative semiconductor die and an operative semiconductor die.
 20. The method of claim 1, in which the substrate comprises one of a circuit board, circuit card, lead frame and tape automated bonding (TAB) tape.
 21. A method of making a multiple die stacked device, comprising: stacking a plurality of semiconductor dice in a stack on a substrate having conductive areas on both sides thereof, the stacking comprising: attaching a first semiconductor die to the substrate; and attaching subsequent semiconductor dice thereto to form the stack, each semiconductor die of the plurality of semiconductor dice in the stack being similar in shape, the semiconductor die of the plurality of semiconductor dice having bond pads along two edges of an active surface which are opposed from each other and having bond pads on less than three edges; offsetting a physical orientation of each of the subsequent semiconductor dice of the plurality of semiconductor dice in at least one direction from its underlying semiconductor die and rotating each subsequent semiconductor die in one of 90, 180 and 270 degrees relative to the underlying semiconductor die to expose bond pads of the underlying semiconductor die while minimizing the size of the multiple die stacked device; and attaching solder balls to conductive areas on another side of a substrate, the conductive areas on the another side of the substrate connected to at least one conductive area on one side of the substrate.
 22. A method of making a high density stacked multiple-die device, comprising: attaching a first semiconductor die having a rectangular active surface having at least four edges, a backside, and a field of conductive bond pads disposed on the active surface along two edges of the active surface which are opposed from each other thereof to a surface of a substrate having conductive bond areas on both sides thereof adjacent the conductive bond areas of the substrate surface having the field of conductive bond pads positioned along less than three edges thereof; attaching the backside of a second semiconductor die to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die exposed; forming conductors connecting conductive bond pads of the first semiconductor die to the conductive bond areas of the substrate; forming conductors connecting conductive bond pads of a second semiconductor die having a rectangular active surface having at least four edges, a backside, and a field of conductive bond pads disposed on the active surface thereof to one of the conductive bond areas of the substrate and conductive bond pads of the first semiconductor die; and attaching solder balls to conductive bond areas on another side of a substrate, the conductive bond areas on the another side of the substrate connected to at least one conductive bond area on one side of the substrate.
 23. The method of claim 22, wherein a plurality of semiconductor dice comprises a stack of semiconductor dice, each semiconductor die being one of substantially the same size and of different size.
 24. The method of claim 22, further comprising attaching at least one additional semiconductor die having a backside to the active surface of a next lower semiconductor die in an offset position, the field of conductive bond pads of each semiconductor die exposed for attachment of the conductors thereto.
 25. The method of claim 22, further comprising attaching the first semiconductor die to the substrate by a thin adhesive layer and attaching the second semiconductor die to the first semiconductor die by a thin adhesive layer.
 26. The method of claim 22, wherein each semiconductor die has the field of conductive bond pads along one edge thereof, and the second semiconductor die is offset from the first semiconductor die in one direction to expose the conductive bond pads of the first semiconductor die for establishing connections from the conductive bond pads to the substrate.
 27. The method of claim 26, further comprising affixing at least one additional semiconductor die in a stack of semiconductor dice to the second semiconductor die and offsetting an additional semiconductor die from its underlying semiconductor die, wherein each semiconductor die is offset in the same direction from its underlying semiconductor die.
 28. The method of claim 27, further comprising rotating at least one of the plurality of semiconductor dice one of 90, 180, and 270 degrees relative to its underlying semiconductor die.
 29. The method of claim 28, wherein the at least one rotated semiconductor die is an uppermost semiconductor die.
 30. The method of claim 29, wherein the at least one rotated semiconductor die is intermediate the first semiconductor die and the uppermost semiconductor die.
 31. The method of claim 26, further comprising affixing at least one additional semiconductor die in a stack of semiconductor dice to the second semiconductor die, each additional semiconductor die offset from its underlying semiconductor die and rotating at least one of the second semiconductor die and a third semiconductor die 180 degrees relative to the first semiconductor die.
 32. The method of claim 31, wherein each semiconductor die is rotated 180 degrees from its underlying semiconductor die and offset in a reverse direction thereto.
 33. The method of claim 26, further comprising attaching at least one additional semiconductor die in a stack to the second semiconductor die, offsetting an additional semiconductor die from its underlying semiconductor die, and rotating the second semiconductor die and each subsequent semiconductor die 90 degrees from its underlying semiconductor die to position conductive bond pads on at least three sides of the stack.
 34. The method of claim 26, wherein each semiconductor die has the field of conductive bond pads along two adjacent edges thereof, and each of the second and subsequent semiconductor dice is offset from its underlying semiconductor die in two directions exposing the conductive bond pads thereof for conductive bonding.
 35. The method of claim 34, further comprising offsetting each semiconductor die in the same two directions relative to its underlying semiconductor die.
 36. The method of claim 34, further comprising rotating at least one semiconductor die 180 degrees from its underlying semiconductor die.
 37. The method of claim 36, wherein the at least one rotated semiconductor die includes a topmost semiconductor die.
 38. The method of claim 26, wherein each semiconductor die has a length greater than a width whereby rotation of one semiconductor die relative to an underlying adjacent semiconductor die offsets the first semiconductor die to expose the field of conductive bond pads for attaching the conductors thereto.
 39. The method of making a high density stacked multiple-die device of claim 22, comprising: a lower semiconductor die having a field of conductive bond pads positioned thereon for attachment to conductive bond wires with loops; an upper semiconductor die overhanging the field of conductive bond pads by a first height; and an intervening semiconductor die having an upper surface bonded to the upper semiconductor die with an adhesive layer and a lower surface bonded to the lower semiconductor die with an adhesive layer, the intervening semiconductor die offset from the lower semiconductor die and the upper semiconductor die, a height of overhang between the lower semiconductor die and the upper semiconductor die substantially equals the thickness of the intervening semiconductor die and the two adhesive layers and the height of overhang exceeds the height of bond wire loops attached to the conductive bond pads of the lower semiconductor die.
 40. The method of claim 22, in which the substrate comprises one of a circuit board, circuit card, lead frame and tape automated bonding (TAB) tape.
 41. A method of making a high density multiple die stacked device, comprising: stacking a plurality of semiconductor dice attached in a stack on a substrate having conductive areas on both sides thereof, the stacking comprising: attaching a first semiconductor die to the substrate, the first semiconductor die having bond pads along two edges of an active surface which are opposed from each other and having bond pads on less than three edges; stacking subsequent semiconductor dice to the first semiconductor die forming a stack, the subsequent semiconductor dice in the stack being similar; orienting each of a second semiconductor die and the subsequent semiconductor dice by offsetting each of the second semiconductor die and the subsequent semiconductor dice in at least one direction from their underlying semiconductor die and rotated in one of 0, 90, 180 and 270 degrees relative to the underlying semiconductor die; exposing bond pads of the underlying semiconductor die while minimizing the size of the high density multiple die stacked device; and attaching solder balls to conductive areas on another side of a substrate, the conductive areas on the another side of the substrate connected to at least one conductive area on one side of the substrate.
 42. The method of claim 41, wherein one of the plurality of semiconductor dice includes one of a piece of silicon and an inoperative semiconductor die and an operative semiconductor die.
 43. The method of claim 41, wherein one of the plurality of semiconductor dice includes a piece of silicon.
 44. The method of claim 41, further comprising attaching the plurality of semiconductor dice to each other using an adhesive having a thickness of about less than 100 microns.
 45. A method of making a multiple-semiconductor die device, comprising: attaching the backside of a first semiconductor die having an active surface including at least four edges, a backside, and a field of conductive bond pads disposed on the active surface thereof along two edges of an active surface which are opposed from each other, the field of conductive bond pads positioned along less than three edges of the active surface of the semiconductor die, to a surface having at least one conductive bond area on the surface of a substrate having conductive bond areas on both surfaces thereof adjacent the at least one conductive bond area of the substrate surface; attaching the backside of a second semiconductor die to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die being exposed; forming conductors connecting conductive bond pads of the first semiconductor die to the at least one conductive bond area of the substrate; forming conductors connecting bond pads of the second semiconductor die to the at least one conductive bond area of the substrate and conductive bond pads of the first semiconductor die; and attaching solder balls to conductive bond areas on another side of a substrate, the conductive bond areas on the another side of the substrate connected to at least one conductive bond area on one side of the substrate.
 46. The method of claim 45, wherein the plurality of semiconductor dice comprises a stack of semiconductor dice having one of substantially different dimensions.
 47. The method of claim 45, further comprising: attaching at least one additional semiconductor die having a backside to at least a portion of the active surface of the next lower semiconductor die in an offset position; and exposing the field of conductive bond pads of each semiconductor die being for attachment of the conductors thereto.
 48. The method of claim 45, wherein each semiconductor die has the field of conductive bond pads along one edge thereof, and the second semiconductor die being offset from the first semiconductor die in one direction to expose the conductive bond pads of the first semiconductor die for establishing connections from the conductive bond pads to the substrate.
 49. The method of claim 48, further comprising attaching at least one additional semiconductor die in a stack to the second semiconductor die and offsetting each additional semiconductor die from its underlying semiconductor die, each semiconductor die being offset in the same direction from its underlying semiconductor die.
 50. The method of claim 49, further comprising rotating at least one of the plurality of semiconductor dice one of 90, 180, and 270 degrees relative to its underlying semiconductor die.
 51. The method of claim 49, further comprising: affixing at least another additional semiconductor die in a stack to the second semiconductor die, each additional semiconductor die offset from its underlying semiconductor die; and rotating at least one of the second semiconductor die and a third semiconductor die 180 degrees relative to the first semiconductor die.
 52. The method of claim 50, further comprising: rotating each semiconductor die 180 degrees from its underlying semiconductor die; and offsetting each semiconductor die in a reverse direction thereto.
 53. The method of claim 49, further comprising affixing at least another additional semiconductor die in a stack to the second semiconductor die, offsetting each additional semiconductor die from its underlying semiconductor die, and rotating the second semiconductor die and each subsequent semiconductor die 90 degrees from its underlying semiconductor die to position bond pads on at least three sides of the stack.
 54. The method of claim 49, wherein each semiconductor die has the field of conductive bond pads along two adjacent edges thereof, and each of the second semiconductor die and subsequent semiconductor dice being offset from its underlying semiconductor die in two directions exposing the bond pads thereof for conductive bonding.
 55. The method of claim 53, further comprising offsetting each semiconductor die in the same two directions relative to its underlying semiconductor die.
 56. The method of claim 53, further comprising rotating at least one semiconductor die 180 degrees from its underlying semiconductor die.
 57. The method of claim 55, wherein the at least one rotated semiconductor die includes a topmost semiconductor die.
 58. The method of claim 49, wherein each semiconductor die has a length greater than a width whereby rotation of one semiconductor die relative to an underlying adjacent semiconductor die offsets the first semiconductor die to expose the field of conductive bond pads for attaching the conductors thereto.
 59. The method of claim 49, further comprising: positioning a lower semiconductor die having a field of conductive bond pads thereon for attachment to conductive bond wires with loops; overhanging an upper semiconductor die on the field of conductive bond pads by a first height; and positioning an intervening semiconductor die having an upper surface bonded to the upper semiconductor die with an adhesive layer and a lower surface bonded to the lower semiconductor die with an adhesive layer, the intervening semiconductor die offset from the lower and upper semiconductor dice, a height of overhang between the lower semiconductor die and upper semiconductor die being substantially equal to the thickness of the intervening semiconductor die and the two adhesive layers and the height of overhang exceeding the height of bond wire loops attached to the conductive bond pads of the lower semiconductor die.
 60. The method of claim 59, wherein the intervening semiconductor die includes one of a piece of silicon and an inoperative semiconductor die and an operative semiconductor die.
 61. The method of claim 45, in which the substrate comprises one of a circuit board, circuit card, lead frame and tape automated bonding (TAB) tape.
 62. A method of making a high density multiple die stacked device, comprising: forming a stack of a plurality of semiconductor dice on a substrate having conductive areas on both sides thereof by attaching a first semiconductor die to the substrate and subsequent semiconductor dice attached thereto, the plurality of semiconductor dice in the stack having at least two different sizes of semiconductor dice, each semiconductor die having bond pads along two edges of an active surface which are opposed from each other; offsetting each of a second semiconductor die and subsequent semiconductor dice in at least one direction from its underlying semiconductor die while being rotated in one of 90, 180 and 270 degrees relative to the underlying semiconductor die exposing bond pads of the underlying semiconductor die while minimizing the size of the high density multiple die stacked device; and attaching solder balls to conductive areas on another side of a substrate, the conductive areas on the another side of the substrate connected to at least one conductive area on one side of the substrate.
 63. The method of claim 62, wherein one of the plurality of semiconductor dice includes one of a piece of silicon and an inoperative semiconductor die and an operative semiconductor die.
 64. The method of claim 62, wherein one of the plurality of semiconductor dice includes a piece of silicon.
 65. The method of claim 62, further comprising attaching plurality of semiconductor dice to each other using an adhesive having a thickness of about less than 100 microns.
 66. A method of making a high density multiple die stacked device, comprising: attaching a plurality of semiconductor dice in a stack on a substrate having conductive areas on both sides thereof, the stack comprising a first semiconductor die attached to the substrate and subsequent semiconductor dice attached thereto forming the stack, each semiconductor die having bond pads along two edges of an active surface which are opposed from each other, the semiconductor dice in the stack having at least two different sizes of semiconductor die, the size of a semiconductor die on the bottom of the stack having at least one dimension of one of length, width, and thickness which is larger than a corresponding dimension of at least another semiconductor die in the stack, and a physical orientation of each of a second semiconductor die and subsequent semiconductor dice being offset in at least one direction from its underlying semiconductor die and rotated in one of 90, 180 and 270 degrees relative to the underlying semiconductor die exposing bond pads of the underlying semiconductor die while minimizing the size of the high density multiple die stacked device; and attaching solder balls to conductive areas on another side of a substrate, the conductive areas on the another side of the substrate connected to at least one conductive area on one side of the substrate.
 67. The method of claim 66, wherein one of the plurality of semiconductor dice includes one of a piece of silicon and an inoperative semiconductor die and an operative semiconductor die.
 68. The method of claim 66, wherein one of the plurality of semiconductor dice includes a piece of silicon.
 69. The method of claim 66, further comprising attaching the plurality of semiconductor dice to each other using an adhesive having a thickness of about less than 100 microns.
 70. The method of claim 66, wherein at least two dimensions of the bottom semiconductor die of length, width, and thickness are larger in at least one dimension of length, width, and thickness than a corresponding dimension of at least one other semiconductor die in the stack.
 71. A memory device, comprising: a substrate comprising conductive material; a first die including a first set of bond pads along a front edge on a top surface of the first die, wherein the first die is adhered to the substrate; a second die, having the same dimensions as the first die, including a second set of bond pads along a front edge on a top surface of the second die, wherein the front edge of the second die is oriented adjacent to the front edge of the first die, the second die is adhered to the top surface of the first die, and the second die is laterally offset from the first die to expose the first set of bond pads; a first bond wire physically coupled between the first die and the substrate; a second bond wire physically coupled between the second die and the first die; a third bond wire physically coupled between the second die and the substrate; and encapsulating material to encapsulate the first and second dice and the first, second, and third bond wires.
 72. The memory device of claim 71, wherein the first set of bond pads and the second set of bond pads are arranged identically.
 73. The memory device of claim 72, wherein the first and second die include bond pads along no more than the respective front edges of the first and second die.
 74. The memory device of claim 73, further comprising: a third die disposed above the second die, and including bond pads along two adjacent edges of the third die; and a fourth bond wire physically coupled between the third die and the substrate; wherein the encapsulating material is to further encapsulate the third die and the fourth bond wire.
 75. The memory device of claim 74, wherein the first, second, and third bond wires are on a first side of the device, and the fourth bond wire is on a second side of the device adjacent to the first side.
 76. The memory device of claim 75, wherein no bond wires physically couple the third die to any other die in the device.
 77. The memory device of claim 71, further comprising: a third die, having the same dimensions as the second die, including a third set of bond pads along a front edge on a top surface of the third die, wherein the front edge of the third die is oriented adjacent to the front edge of the second die, the third die is adhered to the top surface of the second die, and the third die is laterally offset from the second die in the same direction the second die is laterally offset from the first die to expose the second set of bond pads; a fourth bond wire physically coupled between the third die and the second die; and a fifth bond wire physically coupled between the third die and the substrate; wherein the encapsulating material is to further encapsulate the third die.
 78. The memory device of claim 77, further comprising: a fourth die disposed above the third die, having dimensions different from the third die, and including a fourth set of bond pads oriented in a different direction than the first, second, and third sets of bond pads; and a sixth bond wire physically coupled between the fourth die and the substrate; wherein the encapsulating material is to further encapsulate the fourth die.
 79. The memory device of claim 78, wherein the first, second, and third dice include bond pads along no more than the respective front edges of the first, second, and third dice.
 80. The memory device of claim 79, wherein the fourth die includes bond pads along two adjacent edges of the fourth die.
 81. The memory device of claim 71, further comprising: a spacer disposed above the second die; a third die disposed above the second die, wherein the third die has the same dimensions as the second die, includes a third set of bond pads along a front edge on a top surface of the third die, and the third die is laterally offset from the second die in an opposite direction from which the second die is laterally offset from the first die, such that the front edge of the third die overhangs the front edge of the second die; and a fourth bond wire physically coupled between the third die and the substrate; wherein the encapsulating material is to further encapsulate the third die.
 82. The memory device of claim 81, wherein the first, second, and third dice include bond pads along no more than the respective front edges of the first, second, and third dice.
 83. The memory device of claim 71, wherein the substrate comprises a lead frame.
 84. The memory device of claim 71, wherein the encapsulating material forms a substantially equiangular encapsulating enclosure.
 85. The memory device of claim 71, wherein the substrate comprises a printed circuit board, and the memory device is configured to provide for external electrical coupling using electrical connections other than solder balls.
 86. The memory device of claim 85, wherein bond wires are only on two adjacent sides of the device.
 87. A packaged semiconductor device, comprising: a substrate comprising metallization; a first die including a first set of bond pads, wherein the first die is joined to the substrate by an adhesive; a second die, having the same dimensions as the first die, including a second set of bond pads, the second die joined to the first die by an adhesive and offset from the first die in a forward direction; a third die, having the same dimensions as the first die, including a third set of bond pads, wherein the third die is disposed above the second die; a fourth die, having the same dimensions as the first die, including a fourth set of bond pads, the fourth die joined to the third die by an adhesive and offset from the third die in a forward direction, wherein the first, second, third, and fourth sets of bond pads face the same direction; respective bond wires of a first plurality of bond wires to join at least one bond pad of the first set of bond pads to the metallization, at least one bond pad of the second set of bond pads to the metallization, at least one bond pad of the third set of bond pads to the metallization, and at least one bond pad of the fourth set of bond pads to the metallization; respective bond wires of a second plurality of bond wires to join at least one bond pad of the second set of bond pads to at least one bond pad of the first set of bond pads, and to join at least one bond pad of the fourth set of bond pads to at least one bond pad of the third set of bond pads; and encapsulant to enclose the first, second, third, and fourth dice and the first and second plurality of bond wires.
 88. The device of claim 87, wherein each of the first, second, third, and fourth dice include bond pads along no more than a single respective edge of each of the first, second, third, and fourth dice.
 89. The device of claim 88, further comprising: a fifth die disposed above the fourth die and including a fifth set of bond pads facing a different direction than the first, second, third, and fourth sets of bond pads; and a third plurality of bond wires to join the fifth set of bond pads to the metallization of the substrate; wherein the encapsulant is to further enclose the fifth die and the third plurality of bond wires.
 90. The device of claim 89, wherein the first and second pluralities of bond wires are on a first side of the device, and the third plurality of bond wires are on a second side of the device adjacent to the first side.
 91. The device of claim 90, wherein no bond wires join the fifth die to any other die in the device.
 92. The device of claim 91, wherein the fifth die has different dimensions than the first die.
 93. The device of claim 92, wherein the fifth die includes bond pads along only two adjacent edges of the fifth die.
 94. The device of claim 92, wherein the substrate is a flash memory card substrate, and the memory device is configured to provide for external electrical coupling using electrical connections other than solder balls.
 95. The device of claim 94, wherein bond wires are only on two adjacent sides of the device.
 96. The device of claim 87, further comprising: a fifth die, disposed above the fourth die and including a fifth set of bond pads; and a third plurality of bond wires to join the fifth set of bond pads to the metallization of the substrate, wherein the fifth die is not joined to any other die in the device by any bond wires.
 97. The device of claim 96, wherein the fifth die has different dimensions than the first die.
 98. The device of claim 96, wherein the first, second, third, and fourth dice have the same bond pad configuration, and the fifth dice has a different bond pad configuration.
 99. The device of claim 98, further comprising a spacer material interposed between at least two of the first, second, third, and fourth dice, wherein the third die is offset from the second die in a reverse direction.
 100. The device of claim 98, wherein each of the first, second, third, and fourth dice include bond pads along no more than a single respective edge of each of the first, second, third, and fourth dice.
 101. The device of claim 100, wherein the substrate is a flash memory card substrate, the memory device is configured to provide for external electrical coupling using electrical connections other than solder balls, and bond wires are only on two adjacent sides of the device.
 102. The device of claim 87, further comprising a spacer material interposed between at least two of the first, second, third, and fourth dice, wherein the third die is offset from the second die in a reverse direction.
 103. The device of claim 102, wherein each of the first, second, third, and fourth dice include bond pads along no more than a single respective edge of each of the first, second, third, and fourth dice.
 104. The device of claim 103, wherein the substrate comprises a lead frame.
 105. The device of claim 87, wherein the substrate comprises a lead frame.
 106. The device of claim 87, wherein the encapsulant forms a substantially equiangular enclosure.
 107. The device of claim 87, wherein the substrate is a flash memory card substrate, and the memory device is configured to provide for external electrical coupling using electrical connections other than solder balls.
 108. The device of claim 107, wherein bond wires are only on two adjacent sides of the device.
 109. A device, comprising: a package substrate; a first die disposed above the substrate and including a first set of bond pads; a second die, having the same dimensions and bond pad layout as the first die, disposed above and attached to the first die and including a second set of bond pads, wherein the second die is offset from the first die in a forward direction to expose the first set of bond pads and the first and second sets of bond pads are oriented in the same direction; a third die, having different dimensions and different bond pad layout than the first die, disposed above the package substrate and including a third set of bond pads; a first bond wire bonded between a bond pad of the first set of bond pads and the substrate; a second bond wire bonded between a bond pad of the second set of bond pads and the substrate; a third bond wire bonded between a bond pad of the third set of bond pads and the substrate; a fourth bond wire bonded between a bond pad of the first set and a bond pad of the second set; and a material that encapsulates the first, second, and third dice.
 110. The device of claim 109, wherein no bond wires are bonded between the third die and any other die in the device.
 111. The device of claim 110, wherein bond wires are bonded to no more than one respective edge of the first and second dice.
 112. The device of claim 111, wherein the first and second bond wires are bonded to the substrate on a first side of the device, and the third bond wire is bonded to the substrate on a second side of the device different from the first side.
 113. The device of claim 112, wherein the substrate is a flash memory card substrate, and the device provides external electrical coupling using electrical connections other than solder balls.
 114. The device of claim 113, wherein the second side of the device is adjacent to the first side of the device.
 115. The device of claim 114, wherein the third die is disposed above the second die.
 116. The device of claim 109, wherein the first and second bond wires are bonded to the substrate on a first side of the device, and the third bond wire is bonded to the substrate on a second side of the device adjacent to the first side.
 117. The device of claim 116, wherein the third die is disposed above the second die.
 118. The device of claim 117, wherein the substrate is a flash memory card substrate, and the device provides external electrical coupling using electrical connections other than solder balls.
 119. The device of claim 109, absent an intervening spacer layer between the first and second die.
 120. The device of claim 119, further comprising a spacer material interposed between at least two adjacent dice of the device, wherein at least one die of the device, having the same dimensions and bond pad layout as the first die, is offset in a reverse direction from a lower die.
 121. The device of claim 109, wherein the substrate comprises a lead frame.
 122. The device of claim 121, wherein the material forms a substantially equiangular package structure.
 123. The device of claim 109, wherein the substrate is a flash memory card substrate, and the device is configured to provide for external electrical coupling using electrical connections other than solder balls.
 124. The device of claim 123, wherein bond wires are only on two adjacent sides of the device. 